Characterization and modeling of electromigration failures in multilayered interconnects and barrier layer materials
- 1 January 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 43 (11) , 1819-1825
- https://doi.org/10.1109/16.543013
Abstract
No abstract availableKeywords
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