Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques
- 1 August 2004
- journal article
- review article
- Published by Elsevier in Solid-State Electronics
- Vol. 48 (8) , 1297-1305
- https://doi.org/10.1016/j.sse.2004.01.012
Abstract
No abstract availableKeywords
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