TEM in situ observation of electromigration damage in Al-Cu strips II. Superimposed AC and DC stressing
- 16 February 1981
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 63 (2) , 655-661
- https://doi.org/10.1002/pssa.2210630233
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- TEM in-situ observation of electromigration damage in Al-Cu strips I. Constant DC stressingPhysica Status Solidi (a), 1981
- Electromigration behaviour and the lifetime of aluminum thin film conductors under superimposed dc and noise powersPhysica Status Solidi (a), 1980
- Failure of small thin-film conductors due to high current-density pulsesIEEE Transactions on Electron Devices, 1979
- Electromigration in cobalt filmsThin Solid Films, 1976
- Electromigration in conductor stripes under pulsed dc poweringApplied Physics Letters, 1972
- Electromigration Failure at Aluminum-Silicon ContactsJournal of Applied Physics, 1972
- An advanced method for studying electrotransport in thin films using electrical resistancePhysica Status Solidi (a), 1970