Extremely reliable bonding of large silicon dice using gold-tin alloy
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopyJournal of Electronic Materials, 1989
- Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Fluxless and virtually voidless soldering for semiconductor chipsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Successful alloy attachment of GaAs MMIC'sIEEE Transactions on Electron Devices, 1987
- Die bond materials and bonding mechanisms in microelectronic packagingThin Solid Films, 1987
- Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-CrackingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Physics of Die Attach InterfacesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1980
- Properties of Die Bond Alloys Relating to Thermal FatigueIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925