Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper
- 1 December 2000
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 377-378, 592-596
- https://doi.org/10.1016/s0040-6090(00)01443-7
Abstract
No abstract availableKeywords
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