Microstructural evolution of Al-Cu thin-film conducting lines during post-pattern annealing
- 1 July 1997
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 82 (1) , 196-200
- https://doi.org/10.1063/1.365760
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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