Failures induced by electromigration in ECL 100k devices
- 1 January 1984
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 24 (1) , 77-100
- https://doi.org/10.1016/0026-2714(84)90641-3
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- A Monolithic Low Power PCM Repeater CircuitIEEE Transactions on Communications, 1979
- Copper electromigration in aluminumJournal of Applied Physics, 1977
- Electromigration damage in aluminum-copper filmsThin Solid Films, 1976
- Electromigration effects in aluminum alloy metallizationJournal of Electronic Materials, 1974
- Subnanosecond emitter-coupled logic gate circuit using Isoplanar IIIEEE Journal of Solid-State Circuits, 1973
- Precipitation and solid solution effects in aluminum-copper thin films and their influence on electromigrationJournal of Applied Physics, 1973
- Effect of Microstructure on the Electromigration Life of Thin-Film A1–Cu ConductorsJournal of Applied Physics, 1972
- Activation Energy for Electromigration Failure in Aluminum Films Containing CopperJournal of Vacuum Science and Technology, 1972
- Hillock Growth on Vacuum Deposited Aluminum FilmsJournal of Vacuum Science and Technology, 1972
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970