The Impact of Interfacial Void Formation on Pb-free Sn-4.0Ag-0.5Cu BGA Solder Joint Integrity
- 10 July 2006
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1191-1195
- https://doi.org/10.1109/ectc.2006.1645803
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
- Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strengthJournal of Electronic Materials, 2004
- Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder on the Interfacial Reaction with Au/Ni MetallizationChemistry of Materials, 2003
- Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packagesSoldering & Surface Mount Technology, 2002
- Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion goldPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Effect of PCB finish on the reliability and wettability of ball grid array packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reliability and Au embrittlement of lead free solders for BGA applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Missing solder ball failure mechanisms in plastic ball grid array packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Manufacturing concerns when soldering with gold plated component leads or circuit board padsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1997