Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
- 1 December 2002
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 14 (3) , 25-29
- https://doi.org/10.1108/09540910210444692
Abstract
No abstract availableKeywords
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