CO2 Laser CVD of Disilane

Abstract
Amorphous silicon films were deposited by a CO2 laser CVD (chemical vapor deposition) method using disilane gas. With this gas, the films were deposited reasonably fast at relatively low substrate temperatures of 350°C or above. Unlike monosilane, photo-induced effects in the gas phase following light absorption were negligible in deposition processes, and only the pyrolytic process taking place at the laser-heated substrate was important. Some of the physical properties of deposited films were described.