IC failure analysis: magic, mystery, and science
- 1 July 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test of Computers
- Vol. 14 (3) , 59-69
- https://doi.org/10.1109/54.605998
Abstract
Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms.Keywords
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