Growth, selectivity and adhesion of CVD-deposited copper from Cu+1 (hexafluoroacetylacetonate trimethylvinylsilane) and dichlorodimethylsilane
- 1 December 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 270 (1-2) , 483-488
- https://doi.org/10.1016/0040-6090(95)06706-x
Abstract
No abstract availableKeywords
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