Gate dielectric formation and MIS interface characterization on Ge
- 1 September 2007
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 84 (9-10) , 2314-2319
- https://doi.org/10.1016/j.mee.2007.04.129
Abstract
No abstract availableKeywords
This publication has 30 references indexed in Scilit:
- Effects of ambient conditions in thermal treatment for Ge(0 0 1) surfaces on Ge–MIS interface propertiesSemiconductor Science and Technology, 2006
- Effect of hafnium germanate formation on the interface of HfO2/germanium metal oxide semiconductor devicesApplied Physics Letters, 2006
- Barrier permeation effects on the inversion layer subband structure and its applications to the electron mobilityMicroelectronic Engineering, 2005
- Atomic Layer Deposition of High-$kappa$Dielectric for Germanium MOS Applications—Substrate Surface PreparationIEEE Electron Device Letters, 2004
- Local epitaxial growth of ZrO2 on Ge (100) substrates by atomic layer epitaxyApplied Physics Letters, 2003
- First-principles modeling of paramagnetic Si dangling-bond defects in amorphousPhysical Review B, 2002
- Distinctly different thermal decomposition pathways of ultrathin oxide layer on Ge and Si surfacesApplied Physics Letters, 2000
- Strict thermal nitridation selectivity between Si and Ge used as a chemical probe of the outermost layer of Si1−xGex alloys and Ge/Si(001) or Si/Ge(001) heterostructuresJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1994
- Electron cyclotron resonance plasma and thermal oxidation mechanisms of germaniumJournal of Vacuum Science & Technology A, 1994
- The role of an ultrathin silicon interlayer at the SiO2-Ge interfaceJournal of Applied Physics, 1992