Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying
- 1 November 2002
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (11) , 1166-1174
- https://doi.org/10.1007/s11664-002-0006-x
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend testsJournal of Electronic Materials, 2001
- Application of an asymmetrical four point bend shear test to solder jointsJournal of Electronic Materials, 2001
- Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finishJournal of Electronic Materials, 2001
- Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials, 2001
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials, 2000
- High temperature solder alloys for underhood applications. Progress reportPublished by Office of Scientific and Technical Information (OSTI) ,1995
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Progress in the design of new lead-free solder alloysJOM, 1993