Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (4) , 478-490
- https://doi.org/10.1109/95.650938
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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