Nickel-chromium interface resolution in Auger depth profiles

This publication has 16 references indexed in Scilit:

• Interface depth resolution of Auger sputter profiled Ni/Cr interfaces: Dependence on ion bombardment parameters
  Journal of Vacuum Science & Technology A, 1985
• Improved depth resolution by sample rotation during Auger electron spectroscopy depth profiling
  Thin Solid Films, 1985
• The ultra-high resolution depth profiling reference material — Ta2O5 anodically grown on Ta
  Surface Science, 1984
• Rutherford backscattering analysis of multilayered CrNi structures to be used for sputtering standards
  Nuclear Instruments and Methods in Physics Research, 1983
• The depth dependence of the depth resolution in composition–depth profiling with Auger Electron Spectroscopy
  Surface and Interface Analysis, 1983
• Application of Auger Depth Profiling on the Al-SiO2 Interface
  Physica Status Solidi (a), 1982
• The statistical sputtering contribution to resolution in concentration-depth profiles
  Thin Solid Films, 1981
• Sputter-induced roughness in thermal SiO2 during Auger sputter profiling studies of the Si–SiO2 interface
  Journal of Vacuum Science and Technology, 1980
• Sputter Profiling Through Ni/Fe Interfaces by Auger Electron Spectroscopy
  IBM Journal of Research and Development, 1978
• Influence of ion bombardment on depth resolution in Auger electron spectroscopy analysis of thin gold films on nickel
  Thin Solid Films, 1976