Growth of SiO2 Thin Film by Selective Excitation Photo-CVD Using 123.6 nm VUV Light

Abstract
A new technology for low-temperature growth of high-quality silicon dioxide (SiO2) film on silicon has been developed. The technology is photo-CVD using 123.6 nm light of a Kr resonance lamp from Si2H6 and O2, in which only Si2H6 can be selectively excited but not O2. The amounts of Si-OH bondings in the SiO2 films deposited by the 123.6 nm light are much lower than those by the other VUV lamps. The interface state density of the Si-MOS diode is extremely low, and its minimum value is 2×1010 cm-2 eV-1 near the Si midgap for the SiO2 film deposited at a substrate temperature of 145°C.