Control of compound forming reaction at the interface between SnZn solder and Cu substrate
- 19 April 2005
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 392 (1-2) , 200-205
- https://doi.org/10.1016/j.jallcom.2004.09.043
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interfaceJournal of Alloys and Compounds, 2004
- Phase diagram calculation on Sn–Zn–Ga soldersJournal of Non-Crystalline Solids, 2004
- Properties of lead-free solder alloys with rare earth element additionsMaterials Science and Engineering: R: Reports, 2004
- Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoatingJournal of Alloys and Compounds, 2003
- Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloysScripta Materialia, 2003
- Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrateJournal of Alloys and Compounds, 2003
- Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloysJournal of Alloys and Compounds, 2003
- Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu JointsMATERIALS TRANSACTIONS, 2002
- Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder MaterialMATERIALS TRANSACTIONS, 2002
- Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrateScripta Materialia, 1999