Anistropic multi-step etch processes of silicon
- 1 September 1997
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 7 (3) , 137-140
- https://doi.org/10.1088/0960-1317/7/3/015
Abstract
The aim of this work is the extension of shape plurality in silicon bulk micromechanics created by anisotropic chemical wet etching with a combination of two or more etch steps. The design of etch masks requires knowledge of the kind and etch rate of crystallographic faces which develop at the sidewalls of the underetched edges of the mask. New or improved micromechanical and micro-optical elements can be obtained by combining typical sidewalls.Keywords
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