The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

This publication has 10 references indexed in Scilit:

• Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Controlled collapse chip connection (C4)-an enabling technology
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Thermal modelling of the Pentium processor package
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Development, validation and application of a thermal model of a plastic quad flat pack
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Motorola's PowerPC 603 and PowerPC 604 RISC microprocessor: the C4/ceramic-ball-grid array interconnect technology
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• A novel approach for the thermal characterization of electronic parts
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• A hi-density C4/CBGA interconnect technology for a CMOS microprocessor
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
• Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
• Package thermal resistance model: dependency on equipment design
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988