Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints
Open Access
- 1 November 2003
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (11) , 1257-1264
- https://doi.org/10.1007/s11664-003-0020-7
Abstract
No abstract availableKeywords
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