Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different Solder Ball Composition
- 28 April 2006
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 255-261
- https://doi.org/10.1109/eptc.2005.1614403
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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