Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
- 1 January 2004
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 45 (3) , 673-680
- https://doi.org/10.2320/matertrans.45.673
Abstract
No abstract availableKeywords
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