Sacrificial layer process with laser-driven release for batch assembly operations
Open Access
- 1 December 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 7 (4) , 416-422
- https://doi.org/10.1109/84.735350
Abstract
A dry sacrificial layer process is presented in which microstructures fabricated on UV-transparent substrates are released by excimer laser ablation of a polymer sacrificial material using laser light incident from the reverse side of the substrate. We investigate the application of this technique to the batch assembly of hybrid microelectromechanical systems (MEMS) built from parts fabricated on different substrates. Preliminary measurements of initial velocity are presented for nickel test structures released from polyimide sacrificial layers using a KrF excimer laser. At fluences in the range 50-250 mJ/cm/sup 2/ (i.e., close to the ablation threshold), structures with heights of 100 /spl mu/m are shown to exhibit initial velocities in the range 15 ms/sup -1/, allowing controlled transfer of parts between substrates. Application of the new assembly method to a MEMS device is demonstrated by assembling arrays of electrostatic wobble motors from component parts fabricated on separate substrates by UV-LIGA processing.Keywords
This publication has 36 references indexed in Scilit:
- The formation of moulds for 3D microstructures using excimer laser ablationMicrosystem Technologies, 1996
- Optical DUV-lithography for high microstructuresMicrosystem Technologies, 1996
- Laminated dry film resist for microengineering applicationsMicroelectronic Engineering, 1996
- Integration of 3-D shape construction and assembly to realize micro systemsMicrosystem Technologies, 1995
- Demonstration of three-dimensional microstructure self-assemblyJournal of Microelectromechanical Systems, 1995
- Removal of Microcontaminants From Surfaces Using a Chemicalfree, Laser-Assisted ProcessMRS Proceedings, 1994
- Metallic microstructures fabricated using photosensitive polyimide electroplating moldsJournal of Microelectromechanical Systems, 1993
- Piezoelectric microphone with on-chip CMOS circuitsJournal of Microelectromechanical Systems, 1993
- Integrated fabrication of polysilicon mechanismsIEEE Transactions on Electron Devices, 1988
- Integrated movable micromechanical structures for sensors and actuatorsIEEE Transactions on Electron Devices, 1988