Electromigration and reliability in submicron metallization and multilevel interconnection
- 1 March 1993
- journal article
- review article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 33 (3-4) , 176-188
- https://doi.org/10.1016/0254-0584(93)90060-y
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
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