Buried dopant and defect layers for device structures with high-energy ion implantation
- 1 February 1989
- journal article
- Published by Elsevier in Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
- Vol. 37-38, 941-950
- https://doi.org/10.1016/0168-583x(89)90331-5
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Proximity gettering with mega-electron-volt carbon and oxygen implantationsApplied Physics Letters, 1988
- Latchup performance of retrograde and conventional n-well CMOS technologiesIEEE Transactions on Electron Devices, 1987
- Profile studies of MeV ions implanted into SiNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1987
- MeV-energy B+, P+ and As+ ion implantation into SiNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1987
- Effects of high energy boron ions implanted in MOSFETsNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1987
- Programming of ROMs after metal definition using MEV ion implantationNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1987
- The inverse-narrow-width effectIEEE Electron Device Letters, 1986
- The crystalline to amorphous transformation in siliconNuclear Instruments and Methods in Physics Research, 1983
- Megavolt arsenic implantation into siliconThin Solid Films, 1982
- On interstitial dislocation loops in aluminium bombarded with alpha-particlesPhilosophical Magazine, 1962